They systematically reviewed The existing processing flows for SiC wafers, substance removal mechanisms, and processing technologies, and provided steerage on future directions for SiC wafer processing. MDPI and/or even the editor(s) disclaim accountability for almost any personal injury to people today or assets ensuing from any ideas, techniques, Directions or https://www.facebook.com/permalink.php?story_fbid=pfbid02CgAiVhZ4NSBg2uWJKv63dv2DiJ5boogSePEZHkVQmLVuEt7nUkYQj8Xa9tQHUAS6l&id=61562415773754&__cft__[0]=AZU7soqQRdi0-0z9paHiW1AUpnanPyDpEYLt-mj6wO2WbgCSws1klflwE0lBk0y87B6A9V3KBp6FYTS22w3irYlKtuO6xSAJW6nKk3y26fZNbGhJ441al1yPgRjjzL8Uvm1zM-JEMjujjIbyNY-TSNPyxOJfJFXxRkiMbjEwtV87ZerSmjT9OzixT_TScDwp9IydE1dFym7njNtshdjIOhya&__tn__=%2CO%2CP-R